SMART Joint Compound

SMART Joint Compound is a high-quality, plaster-based, powder-type compound specially formulated to seamlessly fill, connect, and smooth joints in interior gypsum plasterboards, cement boards, fiber cement boards, particle boards, OSB boards, MDF boards, and similar wall and ceiling boards. It is also effective for covering surface imperfections such as dents, cracks, and holes on walls. SMART Joint Compound offers a wide range of benefits, including excellent filling capability, high bonding strength, fast hardening and drying, superior crack resistance, non-shrinkage, easy application, effortless sanding, and long-lasting durability. Ideal for residential, commercial, and industrial projects, SMART Joint Compound is the ultimate choice for achieving flawless walls and ceilings.

A specially formulated plaster base compound

  • easy application
  • excellent filling property
  • high bonding strength
  • fast hardening and drying
  • good crack-bridging
  • non-shrinkage

BY SCRAPER

  • Ready after mixing with water
  • Keep container tightly closed and keep out of reach of children.
  • Keep away from food, drink and animal feeding stuffs. It may be harmful if swallowed.
  • A suitable mask should be worn when rubbing down.
  • Ensure good ventilation during application and drying.
  • Suitable mask should be worn when sanding.
  • When applying paint, it is advisable to wear eye protection.
  • In case of contact with eyes, rinse immediately with plenty of water and seek medical advice.
  • Remove splashes from skin, use soap and water or a recognised skin cleaner.
  • Care must be taken when transporting.
  • Protect from extremes of temperature. Store in a cool place. In the event of an accident, contain and collect spillage by using sand or earth.
  • Do not empty into drains or water courses.
  • Dispose of any waste in accordance with the appropriate environmental quality regulations.
  • No Lead and Mercury.

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This is the additive to be used with UPG High-Performance Etching Primer.

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